Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2017
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Application #:
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14703476
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Filing Dt:
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05/04/2015
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Publication #:
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Pub Dt:
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02/04/2016
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Inventors:
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Fengze Hou, Tingyu Lin
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Title:
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HEAT DISSIPATION SOLUTION FOR ADVANCED CHIP PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| D1, CHINA NETWORK INT'L INNOVATION PARK |
| 200 LINGHU BOULEVARD |
| WUXI, JIANGSU, CHINA 214135 |
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| GOODWIN PROCTER LLP-PATENT ADMINISTRATOR |
| 53 STATE STREET |
| BOSTON, MA 02109 |
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