Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2017
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Application #:
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14526518
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Filing Dt:
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10/29/2014
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Publication #:
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Pub Dt:
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05/05/2016
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Inventors:
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Xiaotian Zhang, Jun Lu, Kai Liu
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Title:
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SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEAD FRAME AND CHIP, AND ITS MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 475 OAKMEAD PKWY |
| SUNNYVALE, CALIFORNIA 94085 |
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| BO-IN LIN |
| 13445 MANDOLI DRIVE |
| LOS ALTOS HILLS, CA 94022 |
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