Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/23/2017
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Application #:
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15082576
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Filing Dt:
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03/28/2016
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Inventors:
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Daniel W. Harris, Joseph W. Hahn, John Ditri, Michael K. McNulty
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Title:
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INTEGRATION OF CHIP LEVEL MICRO-FLUIDIC COOLING IN CHIP PACKAGES FOR HEAT FLUX REMOVAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6801 ROCKLEDGE DRIVE |
| BETHESDA, MARYLAND 20817 |
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| HOWARD IP LAW GROUP |
| P.O. BOX 226 |
| FORT WASHINGTON, PA 19034 |
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