Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/23/2017
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Application #:
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14719783
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Filing Dt:
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05/22/2015
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Publication #:
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Pub Dt:
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12/03/2015
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Inventor:
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Masahiko KOBAYAKAWA
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Title:
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LED MODULE AND LED MODULE PACKAGING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21, SAIIN MIZOSAKICHO, UKYO-KU |
| KYOTO, JAPAN |
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| HAMRE, SCHUMANN, MUELLER & LARSON, P.C. |
| P.O. BOX 2902 |
| MINNEAPOLIS, MN 55402 |
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