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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
05/23/2017
Application #:
14476549
Filing Dt:
09/03/2014
Inventors:
Pui Yin Yu, Henrik Jacobsson
Title:
EMBEDDED COINS FOR HDI OR SEQ LAMINATIONS
Assignment: 1
Reel/Frame:
033662/0268Recorded: 09/03/2014Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/03/2014
Exec Dt:
09/03/2014
Assignee:
305 INTERLOCKEN PARKWAY
BROOMFIELD, COLORADO 80021
Correspondent:
THOMAS B. HAVERSTOCK
162 N WOLFE ROAD
SUNNYVALE, CA 94086
Assignment: 2
Reel/Frame:
042382/0045Recorded: 05/15/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/11/2017
Assignee:
6201 AMERICA CENTER DRIVE
SAN JOSE, CALIFORNIA 95002
Correspondent:
THOMAS B. HAVERSTOCK
162 NORTH WOLFE ROAD
SUNNYVALE, CA 94086
Assignment: 3
Reel/Frame:
044763/0459Recorded: 01/30/2018Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/30/2018
Assignee:
2 CHANGI SOUTH LANE
SINGAPORE, SINGAPORE 486123
Correspondent:
JACK R. HARRIS
162 NORTH WOLFE ROAD
SUNNYVALE, CA 94086

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