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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	9666566	Issue Dt:	05/30/2017	Application #:	15138993	Filing Dt:	04/26/2016
Inventors:	Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou et al
Title:	3DIC Structure and Method for Hybrid Bonding Semiconductor Wafers

Assignment: 1

Reel/Frame:

038387/0703

Recorded: 04/26/2016

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

CHEN, JU-SHI

Exec Dt:

04/11/2016

HO, CHENG-YING

Exec Dt:

04/11/2016

CHUANG, CHUN-CHIEH

Exec Dt:

04/11/2016

CHEN, SHENG-CHAU

Exec Dt:

04/11/2016

CHOU, SHIH PEI

Exec Dt:

04/11/2016

SHEN, HUI-WEN

Exec Dt:

04/11/2016

YAUNG, DUN-NIAN

Exec Dt:

04/11/2016

WANG, CHING-CHUN

Exec Dt:

04/12/2016

HUNG, FENG-CHI

Exec Dt:

04/12/2016

TING, SHYH-FANN

Exec Dt:

04/11/2016

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK

HSIN-CHU, TAIWAN 300-77

Correspondent:

SLATER MATSIL, LLP

17950 PRESTON RD., SUITE 1000

DALLAS, TX 75252

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