Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/06/2017
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Application #:
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14648031
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Filing Dt:
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05/28/2015
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Publication #:
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Pub Dt:
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11/05/2015
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Inventors:
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Minoru TOYODA, Tsutomu SUGINO, Daichi KIKUCHI, Koji WATANABE, Satoshi TOMITA et al
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Title:
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LAYERED SOLDER MATERIAL FOR BONDING DIFFERENT SPECIES OF ELECTRODES AND METHOD OF BONDING THE DIFFERENT SPECIES OF ELECTRODES IN AN ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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| DONALD B. HASLETT |
| 601 SW SECOND AVENUE |
| SUITE 1600 |
| PORTLAND, OR 97204 |
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