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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/06/2017
Application #:
14706663
Filing Dt:
05/07/2015
Publication #:
Pub Dt:
03/31/2016
Inventors:
Eun Jung LEE, Sang Jin KIM, Yong Han CHO
Title:
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME
Assignment: 1
Reel/Frame:
035589/0866Recorded: 05/07/2015Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/19/2014
Assignee:
150-20, GONGSE-RO, GIHEUNG-GU
YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 446-902
Correspondent:
LEE & MORSE, P.C.
3141 FAIRVIEW PARK DRIVE
SUITE 500
FALLS CHURCH, VA 22042
Assignment: 2
Reel/Frame:
035843/0107Recorded: 06/16/2015Pages: 8
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE NAMES OF SECOND AND THIRD INVENTORS PREVIOUSLY RECORDED ON REEL 035589 FRAME 0866. ASSIGNOR(S) HEREBY CONFIRMS THE NAMES OF SECOND AND THIRD INVENTORS ARE EUN JUNG LEE AND YONG HAN CHO.
Assignors:
Exec Dt:
12/19/2014
Exec Dt:
12/23/2014
Exec Dt:
12/19/2014
Assignee:
150-20, GONGSE-RO, GIHEUNG-GU
YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 446-902
Correspondent:
LEE & MORSE, P.C.
3141 FAIRVIEW PARK DRIVE, SUITE 500
FALLS CHURCH, VA 22042

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