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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
07/11/2017
Application #:
15209964
Filing Dt:
07/14/2016
Inventors:
Matthieu Lagouge, Qing Zhang, Mohommad Choudhuri, Gul Zeb
Title:
Method of Integrating a Copper Plating Process in a Through-Substrate-Via (TSV) on CMOS Wafer
Assignment: 1
Reel/Frame:
039338/0907Recorded: 07/14/2016Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/12/2016
Exec Dt:
07/13/2016
Exec Dt:
07/12/2016
Exec Dt:
07/13/2016
Assignee:
6501 WILLIAM CANNON DRIVE
AUSTIN, TEXAS 78735
Correspondent:
JERE L. POLMATIER
WHYTE HIRSCHBOECK DUDEK S.C.
555 EAST WELLS STREET, SUITE 1900
MILWAUKEE, WI 53202
Assignment: 2
Reel/Frame:
040626/0683Recorded: 11/16/2016Pages: 39
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/07/2016
Assignee:
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TEXAS 78735
Correspondent:
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TX 78735
Assignment: 3
Reel/Frame:
041414/0883Recorded: 01/12/2017Pages: 39
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016.
Assignors:
Exec Dt:
11/07/2016
Exec Dt:
11/04/2016
Assignee:
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TEXAS 78735
Correspondent:
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TX 78735

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