Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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07/25/2017
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Application #:
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13066219
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Filing Dt:
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04/08/2011
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Publication #:
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Pub Dt:
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10/11/2012
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Inventors:
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David S. Marx, David L. Grant
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Title:
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Wafer shape thickness and trench measurement
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE RUDOLPH ROAD |
| FLANDERS, NEW JERSEY 07836 |
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| TODD R. FRONEK |
| DICKE, BILLIG & CZAJA, PLLC |
| 100 SOUTH FIFTH STREET, SUITE 2250 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE RUDOLPH ROAD |
| FLANDERS, NEW JERSEY 07836 |
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| TODD R. FRONEK |
| DICKE, BILLIG & CZAJA, PLLC |
| 100 SOUTH FIFTH STREET, SUITE 2250 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 16 JONSPIN ROAD |
| WILMINGTON, MASSACHUSETTS 01887 |
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| NESREEN GHEITA |
| 184 SHEPHERDS BUSH ROAD |
| LONDON, W6 7NL UNITED KINGDOM |
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