Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/01/2017
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Application #:
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15364851
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Filing Dt:
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11/30/2016
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Publication #:
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Pub Dt:
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06/15/2017
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Inventor:
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Naoki HAYASHI
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Title:
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SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1913-2 FUKURA |
| USUKI-CITY, OITA, JAPAN 8750053 |
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| TYPHA IP LLC |
| 1819 L STREET NW SUITE 200 |
| WASHINGTON, DC 20036 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1913-2, TAKEGASHITA FUKURA |
| USUKI-SHI, OITA, JAPAN 875-0053 |
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| LAW OFFICE OF KEVIN B. JACKSON |
| 6315 E CACTUS WREN RD |
| PARADISE VALLEY, AZ 85253-8006 |
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