Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/08/2017
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Application #:
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14067727
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Filing Dt:
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10/30/2013
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Inventors:
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Peter HARPER, Hemant DESAI, Demetre KONDYLIS
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Title:
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WAFER LEVEL MICRO-ELECTRO-MECHANICAL SYSTEMS PACKAGE WITH ACCELEROMETER AND GYROSCOPE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 160 RIO ROBLES |
| SAN JOSE, CALIFORNIA 95134 |
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| NORTH WEBER & BAUGH LLP |
| 2479 E. BAYSHORE RD., STE. 707 |
| PALO ALTO, CA 94303 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 200 MARKET AVENUE NORTH |
| SUITE 300 |
| CANTON, OHIO 44702 |
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| HARTMAN GLOBAL IP LAW |
| 2621 CHICAGO ST., STE. A |
| VALPARAISO, IN 46383 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FLAT/RM A 12/F ZJ 300 |
| LOCKHART ROAD |
| WAN CHAI, HONG KONG |
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| MRS. DOMENICA N.S. HARTMAN |
| 2621 CHICAGO STREET |
| SUITE A |
| VALPARAISO, IN 46383 |
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