Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/08/2017
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Application #:
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14109162
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Filing Dt:
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12/17/2013
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Publication #:
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Pub Dt:
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06/18/2015
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Inventors:
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Hsi-Jung Wu, Volume Chien, Ying-Lang Wang, Hsin-Chi Chen, Ying-Hao Chen, Hung-Ta Huang
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Title:
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Semiconductor Wafer And Semiconductor Die
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD.6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| SERVILLA WHITNEY LLC |
| 33 WOOD AVENUE SOUTH |
| SECOND FLOOR, SUITE 210 |
| ISELIN, NJ 08830 |
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