Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/22/2017
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Application #:
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15261202
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Filing Dt:
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09/09/2016
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Inventors:
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Li-Han Hsu, Hsien-Wei Chen, Chi-Hsi Wu, Cheng-Hsien Hsieh, Wei-Cheng Wu, Der-Chyang Yeh et al
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Title:
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Redistribution Layers in Semiconductor Packages and Methods of Forming Same
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 |
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SLATER MATSIL LLP |
17950 PRESTON RD., SUITE 1000 |
DALLAS, TX 75252 |
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