Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/22/2017
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Application #:
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14512514
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Filing Dt:
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10/13/2014
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Publication #:
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Pub Dt:
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04/23/2015
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Inventors:
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Bo-Shiung Huang, Wei-Hsiung Yang, Han-Ching Shih, Cheng-Feng Lin
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Title:
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PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 21, KUNG-YEH 5TH RD. |
| PING-JEN INDUSTRIAL PARK |
| PING-JEN CITY, TAOYUAN COUNTY, TAIWAN |
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| DANIEL R. MCCLURE |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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