Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/12/2017
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Application #:
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15383560
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Filing Dt:
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12/19/2016
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Publication #:
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Pub Dt:
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06/29/2017
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Inventors:
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Li-Chih FANG, Chia-Wei CHANG, Kuo-Ting LIN, Yong-Cheng CHUANG
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Title:
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THIN FAN-OUT MULTI-CHIP STACKED PACKAGES AND THE METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 26, DATONG RD., HSINCHU SCIENCE PARK, HUKOU SHIANG |
| HSINCHU, TAIWAN |
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| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 4000 LEGATO RD., SUITE 310 |
| FAIRFAX, VA 22033 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18612, DECATUR ROAD, |
| MONTE SERENO, CALIFORNIA 95030 |
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| NAGENDRA SRINIVAS CHERUKUPALLI |
| 20961 GARDEN GATE DR., |
| CUPERTINO, CA 95014 |
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