Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/19/2017
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Application #:
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13965287
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Filing Dt:
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08/13/2013
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Publication #:
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Pub Dt:
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12/12/2013
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Inventors:
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Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
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Title:
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Polymer Composition for Microelectronic Assembly
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9921 BRECKSVILLE ROAD |
BRECKSVILLE, OHIO 44141 |
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PROMERUS, LLC |
9921 BRECKSVILLE ROAD |
BRECKSVILLE, OH 44141 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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TENNOZ PARKSIDE BUILDING |
5-8 HIGASHI-SHINAGAWA 2-CHOME |
SHINAGAWA-KU, TOKYO, JAPAN 140-0002 |
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BALARAM GUPTA, C/O PROMERUS, LLC |
9921 BRECKSVILLE ROAD |
BUILDING R |
BRECKSVILLE, OH 44141 |
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