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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/19/2017
Application #:
13965287
Filing Dt:
08/13/2013
Publication #:
Pub Dt:
12/12/2013
Inventors:
Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
Title:
Polymer Composition for Microelectronic Assembly
Assignment: 1
Reel/Frame:
031069/0724Recorded: 08/23/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/18/2011
Exec Dt:
11/18/2011
Exec Dt:
11/18/2011
Exec Dt:
11/29/2011
Assignee:
9921 BRECKSVILLE ROAD
BRECKSVILLE, OHIO 44141
Correspondent:
PROMERUS, LLC
9921 BRECKSVILLE ROAD
BRECKSVILLE, OH 44141
Assignment: 2
Reel/Frame:
037698/0894Recorded: 02/10/2016Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/10/2016
Assignee:
TENNOZ PARKSIDE BUILDING
5-8 HIGASHI-SHINAGAWA 2-CHOME
SHINAGAWA-KU, TOKYO, JAPAN 140-0002
Correspondent:
BALARAM GUPTA, C/O PROMERUS, LLC
9921 BRECKSVILLE ROAD
BUILDING R
BRECKSVILLE, OH 44141

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