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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9773699
Issue Dt:
09/26/2017
Application #:
15000302
Filing Dt:
01/19/2016
Publication #:
20160293484
Pub Dt:
10/06/2016
Inventors:
Jong-Jin Lee, Rak-Hwan Kim, Byung-Hee Kim, Jin-Nam Kim, Tsukasa Matsuda, Wan-Soo Park et al
Title:
METHODS OF FORMING WIRING STRUCTURES INCLUDING A PLURALITY OF METAL LAYERS
Assignment: 1
Reel/Frame:
037523/0811Recorded: 01/19/2016Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEE, JONG-JIN
Exec Dt:
11/03/2015
KIM, RAK-HWAN
Exec Dt:
11/03/2015
KIM, BYUNG-HEE
Exec Dt:
11/03/2015
KIM, JIN-NAM
Exec Dt:
11/03/2015
MATSUDA, TSUKASA
Exec Dt:
12/15/2015
PARK, WAN-SOO
Exec Dt:
11/03/2015
LEE, NAE-IN
Exec Dt:
11/03/2015
CHANG, JAE-WON
Exec Dt:
11/03/2015
JUNG, EUN-JI
Exec Dt:
11/03/2015
CHA, JEONG-OK
Exec Dt:
12/07/2015
HWANG, JAE-WON
Exec Dt:
11/03/2015
HWANG, JUNG-HA
Exec Dt:
11/03/2015
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195
Assignment: 2
Reel/Frame:
037889/0841Recorded: 02/26/2016Pages: 12
Conveyance:
CORRECTIVE ASSIGNMENT TO REMOVE THE FIFTH CONVEYING PARTY DATA PREVIOUSLY RECORDED ON REEL 037523 FRAME 0811. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
LEE, JONG-JIN
Exec Dt:
11/03/2015
KIM, RAK-HWAN
Exec Dt:
11/03/2015
KIM, BYUNG-HEE
Exec Dt:
11/03/2015
KIM, JIN-NAM
Exec Dt:
11/03/2015
PARK, WAN-SOO
Exec Dt:
11/03/2015
LEE, NAE-IN
Exec Dt:
11/03/2015
CHANG, JAE-WON
Exec Dt:
11/03/2015
JUNG, EUN-JI
Exec Dt:
11/03/2015
CHA, JEONG-OK
Exec Dt:
12/07/2015
HWANG, JAE-WON
Exec Dt:
11/03/2015
HWANG, JUNG-HA
Exec Dt:
11/03/2015
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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