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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9773725
Issue Dt:
09/26/2017
Application #:
14613893
Filing Dt:
02/04/2015
Publication #:
20160225705
Pub Dt:
08/04/2016
Inventors:
Kevin Bills, Mahesh Bohra, Jinwoo Choi, Tae Hong Kim, Rohan Mandrekar
Title:
CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE
Assignment: 1
Reel/Frame:
034903/0949Recorded: 02/04/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BILLS, KEVIN
Exec Dt:
03/04/2010
BOHRA, MAHESH
Exec Dt:
03/03/2010
CHOI, JINWOO
Exec Dt:
03/03/2010
HONG, TAE
Exec Dt:
03/03/2010
MANDREKAR, ROHAN
Exec Dt:
03/03/2010
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NO NAME
ARMONK, NEW YORK 10504
Correspondent:
JOSCELYN COCKBURN
7209 FONTANA PLACE
RALEIGH, NC 27615
Assignment: 2
Reel/Frame:
040495/0359Recorded: 12/02/2016Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BILLS, KEVIN
Exec Dt:
11/26/2016
BOHRA, MAHESH
Exec Dt:
11/14/2016
CHOI, JINWOO
Exec Dt:
11/14/2016
KIM, TAE HONG
Exec Dt:
11/17/2016
MANDREKAR, ROHAN
Exec Dt:
11/14/2016
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
CANTOR COLBURN LLP
20 CHURCH STREET, 22ND FLOOR
HARTFORD, CT 06103-3207

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