Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/26/2017
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Application #:
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14874242
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Filing Dt:
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10/02/2015
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Publication #:
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Pub Dt:
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04/07/2016
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Inventors:
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Yutaka UEMATSU, Hiroyuki NAGATOMO, Junichi MASUKAWA
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Title:
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CIRCUIT SUBSTRATE FOR SEMICONDUCTOR PACKAGE WITH MULTIPLE CIRCUIT SUBSTRATE UNITS AND SEMICONDUCTOR PACKAGE THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| ERIC G. KING |
| MILES & STOCKBRIDGE P.C. |
| 1751 PINNACLE DRIVE, SUITE 1500 |
| TYSONS CORNER, VA 22102-3833 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 5-6-36 TOYOSU, KOTO-KU |
| TOKYO, JAPAN 135-0061 |
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| ELLEN S. SIMPSON |
| COLSON LAW GROUP |
| 5555 MAIN STREET |
| BUFFALO, NY 14221 |
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