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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9776856
Issue Dt:
10/03/2017
Application #:
14137672
Filing Dt:
12/20/2013
Publication #:
20150329351
Pub Dt:
11/19/2015
Inventors:
Chun-Wen Cheng, Yi-Chuan Teng, Hung-Chia Tsai, Chia-Hua Chu
Title:
Vacuum Sealed MEMS and CMOS Package
Assignment: 1
Reel/Frame:
031841/0742Recorded: 12/23/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHENG, CHUN-WEN
Exec Dt:
12/17/2013
TENG, YI-CHUAN
Exec Dt:
12/13/2013
TSAI, HUNG-CHIA
Exec Dt:
12/13/2013
CHU, CHIA-HUA
Exec Dt:
12/13/2013
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON ROAD
SUITE 1000
DALLAS, TX 75252
Assignment: 2
Reel/Frame:
043085/0675Recorded: 07/05/2017Pages: 4
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME TO INCLUDE LTD. PREVIOUSLY RECORDED ON REEL 031841 FRAME 0742. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.
Assignors:
CHENG, CHUN-WEN
Exec Dt:
12/17/2013
TENG, YI-CHUAN
Exec Dt:
12/13/2013
TSAI, HUNG-CHIA
Exec Dt:
12/13/2013
CHU, CHIA-HUA
Exec Dt:
12/13/2013
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON ROAD
SUITE 1000
DALLAS, TX 75252

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