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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/10/2017
Application #:
14803138
Filing Dt:
07/20/2015
Publication #:
Pub Dt:
11/12/2015
Inventors:
Yongbo YANG, Antonio Jr. Bambalan DIMAANO, Chun Hong WO
Title:
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
043514/0276Recorded: 09/07/2017Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/12/2013
Exec Dt:
03/12/2013
Exec Dt:
03/12/2013
Assignee:
5 SERANGOON NORTH AVENUE 5
SINGAPORE, SINGAPORE 554916
Correspondent:
HORIZON IP PTE. LTD.
7500A BEACH ROAD
#04-306/308 THE PLAZA
SINGAPORE, 199591 SINGAPORE
Assignment: 2
Reel/Frame:
043856/0225Recorded: 10/13/2017Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/08/2015
Assignee:
22 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569506
Correspondent:
HORIZON IP PTE. LTD.
7500A BEACH ROAD, #04-306/308
THE PLAZA
SINGAPORE, 199591 SINGAPORE

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