Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2017
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Application #:
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14845861
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Filing Dt:
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09/04/2015
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Publication #:
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Pub Dt:
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03/09/2017
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Inventors:
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Louise C. Sengupta, Pierre-Alain S. Auroux, Evan A. Binkerd, Richard J. Blackwell JR. et al
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Title:
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STACKED MODULAR ARCHITECTURE HIGH-RESOLUTION THERMAL CHIP CAMERA
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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PO BOX 868 |
NASHUA, NEW HAMPSHIRE 03061-0868 |
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MAINE CERNOTA AND RARDIN |
547 AMHERST ST., 3RD FLOOR |
NASHUA, NH 03063-4000 |
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06/04/2024 12:47 AM
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