Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/17/2017
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Application #:
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15130167
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Filing Dt:
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04/15/2016
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Publication #:
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Pub Dt:
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01/26/2017
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Inventors:
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Jen-Chieh Wei, Steven Z. Shi, Zhiming Liu, Werner G. Kuhr
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Title:
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Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1455 ADAMS DRIVE |
| SUITE 1630 |
| MENLO PARK, CALIFORNIA 94025 |
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| MARIA S. SWIATEK |
| P.O. BOX 60610 |
| PALO ALTO, CA 94306 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1455 ADAMS DRIVE |
| SUITE 1630 |
| MENLO PARK, CALIFORNIA 94025 |
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| MARIA S. SWIATEK |
| P.O. BOX 60610 |
| PALO ALTO, CA 94306 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3993 NIGORIKAWA, KITA-KU |
| NIIGATA PREFECTURE |
| NIIGATA CITY, JAPAN |
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| MARIA S. SWIATEK |
| P.O. BOX 60610 |
| PALO ALTO, CA 94306 |
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