Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/07/2017
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Application #:
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14613081
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Filing Dt:
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02/03/2015
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Publication #:
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Pub Dt:
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08/04/2016
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Inventors:
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Jason Rye, Randy A. Harris, Vincent Steffan Francischetti, Mario David Silvetti et al
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Title:
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WAFER PROCESSING SYSTEM WITH CHUCK ASSEMBLY MAINTENANCE MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| PERKINS COIE LLP/APPLIED MATERIALS |
| PO BOX 1247 |
| SEATTLE, WA 98111-1247 |
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