Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/07/2017
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Application #:
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15312063
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Filing Dt:
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11/17/2016
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Publication #:
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Pub Dt:
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03/30/2017
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Inventors:
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Rabindra N. DAS, Mark A. GOUKER, Pascale GOUKER, Leonard M. JOHNSON, Ryan C. JOHNSON
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Title:
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Interconnect Structures for Assembly of Multi-Layer Semiconductor Devices
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 77 MASSACHUSETTS AVENUE |
| CAMBRIDGE, MASSACHUSETTS 02139 |
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| DALY, CROWLEY, MOFFORD & DURKEE, LLP |
| 354A TURNPIKE STREET |
| SUITE 301A |
| CANTON, MA 02021-2714 |
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