Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/21/2017
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Application #:
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11793054
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Filing Dt:
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02/29/2008
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Publication #:
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Pub Dt:
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09/04/2008
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Inventors:
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Takeo Kuramoto, Kaichi Tsuruta
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Title:
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Solder Precoating Method and Workpiece For Electronic Equipment
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO 120-8555, JAPAN |
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| MICHAEL TOBIAS |
| 1629 K STREET N.W. |
| SUITE 300 |
| WASHINGTON, DC 20006 |
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