Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/05/2017
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Application #:
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15169591
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Filing Dt:
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05/31/2016
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Inventors:
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Florian G. HERRAULT, Melanie S. YAJIMA, Alexandros MARGOMENOS, Miroslav MICOVIC
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Title:
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WAFER-LEVEL DIE TO PACKAGE AND DIE TO DIE INTERCONNECTS SUSPENDED OVER INTEGRATED HEAT SINKS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3011 MALIBU CANYON ROAD |
| MALIBU, CALIFORNIA 90265-4799 |
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| LADAS & PARRY, LLP |
| 5670 WILSHIRE BLVD. |
| SUITE 2100 |
| LOS ANGELES, CA 90036 |
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