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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	9844837	Issue Dt:	12/19/2017	Application #:	14006538	Filing Dt:	12/27/2013
Publication #:	20140141273	Pub Dt:	05/22/2014
Inventors:	Masato Shimamura, Tsukasa Ohnishi, Mitsuhiro Kosai, Kazuyori Takagi, Tomoko Nonaka et al
Title:	LEAD-FREE SOLDER ALLOY

Assignment: 1

Reel/Frame:

031853/0263

Recorded: 12/27/2013

Pages: 9

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

SHIMAMURA, MASATO

Exec Dt:

12/06/2013

OHNISHI, TSUKASA

Exec Dt:

12/09/2013

KOSAI, MITSUHIRO

Exec Dt:

10/31/2013

TAKAGI, KAZUYORI

Exec Dt:

10/31/2013

NONAKA, TOMOKO

Exec Dt:

10/31/2013

SUZUKI, MASAYUKI

Exec Dt:

12/06/2013

HAYASHIDA, TORU

Exec Dt:

10/31/2013

ISHIBASHI, SEIKO

Exec Dt:

11/24/2013

YOSHIKAWA, SHUNSAKU

Exec Dt:

11/27/2013

YAMANAKA, YOSHIE

Exec Dt:

11/27/2013

Assignee:

SENJU METAL INDUSTRY CO., LTD.

23, SENJU-HASHIDO-CHO, ADACHI-KU

TOKYO, JAPAN 120-8555

Correspondent:

THE WEBB LAW FIRM, P.C.

ONE GATEWAY CENTER

420 FT. DUQUESNE BLVD, SUITE 1200

PITTSBURGH, PA 15222

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