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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9844858
Issue Dt:
12/19/2017
Application #:
13988689
Filing Dt:
05/21/2013
Publication #:
20130241128
Pub Dt:
09/19/2013
Inventors:
Yukio Eda, Toshiyuki Ibayashi, Hiroyuki Kurimura, Yutaka Ogino, Eitaro Fukutaka et al
Title:
FLAT-PLATE BONDING JIG AND METHOD OF MANUFACTURING FLAT-PLATE LAMINATED BODY
Assignment: 1
Reel/Frame:
030463/0626Recorded: 05/22/2013Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
EDA, YUKIO
Exec Dt:
04/01/2013
IBAYASHI, TOSHIYUKI
Exec Dt:
04/02/2013
KURIMURA, HIROYUKI
Exec Dt:
04/08/2013
OGINO, YUTAKA
Exec Dt:
04/01/2013
FUKUTAKA, EITARO
Exec Dt:
04/09/2013
MATSUMOTO, TAKAYUKI
Exec Dt:
04/04/2013
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU
TOKYO, JAPAN 103-8338
Correspondent:
STEIN IP, LLC
1400 EYE ST., N.W.
SUITE 300
WASHINGTON, DC 20005
Assignment: 2
Reel/Frame:
043256/0210Recorded: 07/19/2017Pages: 23
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
Exec Dt:
10/01/2015
Assignee:
DENKA COMPANY LIMITED
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU
TOKYO, JAPAN 103-8338
Correspondent:
STEIN IP LLC
1400 EYE ST. N.W.
SUITE 300
WASHINGTON, DC 20005

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