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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/19/2017
Application #:
14710747
Filing Dt:
05/13/2015
Publication #:
Pub Dt:
11/19/2015
Inventors:
Chak Tong SZE, Pei Wei TSAI, Cho Hin CHEUK, Si Ming CHAN, Kam Sing LEE
Title:
SEMICONDUCTOR PACKAGE TESTING APPARATUS
Assignment: 1
Reel/Frame:
035806/0641Recorded: 06/09/2015Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/19/2015
Exec Dt:
05/19/2015
Exec Dt:
05/19/2015
Exec Dt:
05/19/2015
Exec Dt:
05/19/2015
Assignee:
2 YISHUN AVENUE 7
SINGAPORE, SINGAPORE 768924
Correspondent:
OSTROLENK FABER LLP
1180 AVENUE OF THE AMERICAS
7TH FLOOR
NEW YORK, NY 10036
Assignment: 2
Reel/Frame:
062444/0830Recorded: 01/20/2023Pages: 6
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/25/2022
Assignee:
2 YISHUN AVENUE 7
SINGAPORE, SINGAPORE 768924
Correspondent:
CPA GLOBAL
CASTLE STREET , LIBERATION HOUSE
ST HELIER, JERSEY, JE1 1BL JERSEY

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