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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/26/2017
Application #:
15302635
Filing Dt:
10/07/2016
Publication #:
Pub Dt:
02/02/2017
Inventors:
Daisuke Sato, Shinichiro Ochiai, Sadayuki Kobayashi
Title:
POLYAMIDE RESIN COMPOSITION FOR MOLDED ARTICLE EXPOSED TO HIGH-PRESSURE HYDROGEN AND MOLDED ARTICLE MADE OF THE SAME
Assignment: 1
Reel/Frame:
039965/0013Recorded: 10/07/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/03/2016
Exec Dt:
09/27/2016
Exec Dt:
09/27/2016
Assignee:
1-1, NIHONBASHI-MUROMACHI 2-CHOME
CHUO-KU
TOKYO, JAPAN 103-8666
Correspondent:
IP GROUP OF DLA PIPER LLP (US)
ONE LIBERTY PLACE
1650 MARKET ST, SUITE 4900
PHILADELPHIA, PA 19103

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