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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/02/2018
Application #:
15025880
Filing Dt:
03/29/2016
Publication #:
Pub Dt:
08/18/2016
Inventor:
Kyu Hyung LEE
Title:
METHOD OF MEASURING DEPTH OF DAMAGE OF WAFER
Assignment: 1
Reel/Frame:
038128/0706Recorded: 03/29/2016Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/16/2016
Assignee:
53 IMSU-RO,
GUMI-SI, GYEONGSANGBUK-DO, KOREA, REPUBLIC OF 39386
Correspondent:
KED & ASSOCIATES, LLP
P.O. BOX 8638
RESTON, VA 20195

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