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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/09/2018
Application #:
15264939
Filing Dt:
09/14/2016
Publication #:
Pub Dt:
03/16/2017
Inventors:
Hirobumi TANAKA, Yohei NODA, Keisuke OKAI, Makoto ENDO
Title:
MULTILAYER ELECTRONIC COMPONENT
Assignment: 1
Reel/Frame:
039738/0703Recorded: 09/14/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/15/2016
Exec Dt:
07/15/2016
Exec Dt:
07/15/2016
Exec Dt:
08/09/2016
Assignee:
3-9-1, SHIBAURA
MINATO-KU
TOKYO, JAPAN 108-0023
Correspondent:
JAMES A. OLIFF
OLIFF PLC
P.O. BOX 320850
ALEXANDRIA, VA 22320-4850

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