Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
01/09/2018
|
Application #:
|
14877806
|
Filing Dt:
|
10/07/2015
|
|
Publication #:
|
|
Pub Dt:
|
04/07/2016
| | | | |
|
Inventor:
|
Yu-Lung HUANG
|
|
Title:
|
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
| JHONGLI DIST. |
| TAOYUAN CITY, TAIWAN 32062 |
|
|
|
|
| WEN LIU |
| 350 S. FIGUEROA STREET, SUITE 975 |
| LOS ANGELES, CA 90071 |
|
|
Search Results as of:
05/26/2024 04:33 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
