Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
01/09/2018
|
Application #:
|
14931432
|
Filing Dt:
|
11/03/2015
|
Publication #:
|
|
Pub Dt:
|
05/05/2016
| | | | |
Inventors:
|
Seung Ho Park, Bum Mo Ahn
|
Title:
|
Chip Substrate and Chip Package Module
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
89, ASAN VALLEY-RO, DUNPO-MYEON |
ASAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31409 |
|
|
|
THOMAS J. TUYTSCHAEVERS |
SUNSTEIN KANN MURPHY & TIMBERS LLP |
125 SUMMER STREET |
BOSTON, MA 02110-1618 |
|
|
Search Results as of:
05/30/2024 07:13 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|