Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2018
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Application #:
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15115057
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Filing Dt:
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07/28/2016
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Publication #:
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Pub Dt:
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11/24/2016
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Inventors:
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Aya Ikeda, Sadaaki Katou, Shinjiro Fujii, Syougo Kikuchi, Shu Hashimoto
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Title:
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ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING ADHESIVE COMPOSITION, AND SOLID-STATE IMAGING ELEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-6606 |
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| FITCH, EVEN, TABIN & FLANNERY, LLP |
| 120 SOUTH LASALLE STREET, SUITE 1600 |
| CHICAGO, IL 60603-3406 |
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