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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/16/2018
Application #:
15284295
Filing Dt:
10/03/2016
Publication #:
Pub Dt:
04/06/2017
Inventors:
Ling Yang, Ying Ji, David Secker, Chanh Tran
Title:
DISTRIBUTED ON-CHIP DECOUPLING APPARATUS AND METHOD USING PACKAGE INTERCONNECT
Assignment: 1
Reel/Frame:
040732/0994Recorded: 12/14/2016Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/31/2012
Exec Dt:
11/01/2012
Exec Dt:
10/31/2012
Exec Dt:
10/31/2012
Assignee:
1050 ENTERPRISE WAY, SUITE 700
SUNNYVALE, CALIFORNIA 94089
Correspondent:
ANN WILLIAMS
1050 ENTERPRISE WAY #700
SUNNYVALE, CA 94089

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