Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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01/23/2018
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Application #:
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13874150
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Filing Dt:
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04/30/2013
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Publication #:
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Pub Dt:
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09/19/2013
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Inventors:
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Yaojian Lin, Kang Chen, Yu Gu, Wei Meng, Chee Siang Ong
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Title:
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Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers
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Assignment:
1
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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39TH FLOOR, CITIBANK TOWER, CITIBANK PLAZA, 3 GARDEN ROAD |
ATTENTION: AGENCY AND TRUST |
CENTRAL, HONG KONG |
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LAWRENCE KASS |
28 LIBERTY STREET |
C/O LAWRENCE KASS |
NEW YORK, NY 10005 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE |
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EDWARD J. MAYLE |
1850 K STREET, N.W. |
SUITE 1100 |
WASHINGTON, DC 20006 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT THE SPELLING OF ASSIGNEE'S NAME FROM "STATS CHIPPAC PTE. LTE. " TO STATS CHIPPAC PTE. LTD." PREVIOUSLY RECORDED AT REEL: 038378 FRAME: 0391. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE |
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DARIA DELIZIO |
1919 PENNSYLVANIA AVE., SUITE 800 |
WASHINGTON, DC 20006 |
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Assignment:
4
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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46429 LANDING PARKWAY |
FREMONT, CALIFORNIA 94538 |
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
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PATENT LAW GROUP: ATKINS AND ASSOCIATES |
123 W. CHANDLER HEIGHTS ROAD, #12535 |
CHANDLER, AZ 85248 |
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