Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/30/2018
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Application #:
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14603363
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Filing Dt:
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01/23/2015
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Publication #:
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Pub Dt:
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03/31/2016
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Inventor:
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Chien-Hung Wu
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Title:
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Manufacturing Method for Multi-Layer Circuit Board Having Cavity
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, GUANGFU N. RD., SCIENCE-BASED INDUSTRIAL PARK, HUKOU TOWNSHIP, |
| HSINCHU COUNTY, TAIWAN 303 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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