Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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02/13/2018
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Application #:
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12458324
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Filing Dt:
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07/08/2009
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Publication #:
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Pub Dt:
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01/14/2010
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Inventors:
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Osamu Koike, Yutaka Kadogawa
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Title:
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Semiconductor device having a dummy portion, method for manufacturing the semiconductor device, method for manufacturing a semiconductor package having the semiconductor device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI |
| TOKYO, JAPAN 193-8550 |
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| ROBERT H. BERDO, JR. |
| RABIN & BERDO, PLC |
| 1101 14TH ST., NW |
| SUITE 500 |
| WASHINGTON, DC 20005 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2-4-8 SHINYOKOHAMA, KOUHOKU-KU |
| YOKOHAMA, JAPAN 222-8575 |
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| RABIN & BERDO, P.C. |
| 1101 14TH ST., N.W., SUITE 500 |
| WASHINGTON, DC 20005 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, CANADA K2H 5B7 |
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| ACHLYS TECHNOLOGIES INC. |
| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, TAIWAN |
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