Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/13/2018
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Application #:
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15373393
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Filing Dt:
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12/08/2016
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Inventors:
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CHUNG HSIUNG HO, WEN-HSUAN LIN
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Title:
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WAFER-LEVEL CHIP SCALE PACKAGE WITH SIDE PROTECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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411 EAST PLUMERIA DRIVE, MS41 |
SAN JOSE, CALIFORNIA 95134 |
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INTELLECTUAL PROPERTY AND LICENSING NXP |
411 EAST PLUMERIA DRIVE, MS41 |
SAN JOSE, CA 95134 |
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05/29/2024 03:13 PM
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