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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
9896330
Issue Dt:
02/20/2018
Application #:
15134574
Filing Dt:
04/21/2016
Publication #:
20170197823
Pub Dt:
07/13/2017
Inventors:
Makoto Yoshino, Brian E. Goodlin, Kurt Peter Wachtler, Ayumu Kuroda, Karen Kirmse et al
Title:
STRUCTURE AND METHOD FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL SYSTEM STACKED ONTO ELECTRONIC CIRCUIT CHIP
Assignment: 1
Reel/Frame:
038340/0225Recorded: 04/21/2016Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WACHTLER, KURT PETER
Exec Dt:
04/15/2016
GOODLIN, BRIAN E.
Exec Dt:
04/18/2016
KIRMSE, KAREN
Exec Dt:
04/18/2016
COOK, BENJAMIN
Exec Dt:
04/19/2016
YOSHINO, MAKOTO
Exec Dt:
04/18/2016
KURODA, AYUMU
Exec Dt:
04/18/2016
YANO, GENKI
Exec Dt:
04/18/2016
JACOBSEN, STUART
Exec Dt:
03/23/1998
Assignee:
TEXAS INSTRUMENTS INCORPORATED
12500 TI BOULEVARD
M/S 3999
DALLAS, TEXAS 75243
Correspondent:
TEXAS INSTRUMENTS INCORPORATED
P O BOX 655474, M/S 3999
DALLAS, TX 75265

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