Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2018
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Application #:
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14799875
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Filing Dt:
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07/15/2015
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Publication #:
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Pub Dt:
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12/15/2016
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Inventors:
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Eun Dong KIM, Jong Won LEE, Jai Kyoung CHOI
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Title:
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METHOD OF MANUFACTURING WAFER LEVEL PACKAGING INCLUDING THROUGH ENCAPSULATION VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 16, BAEKSEOKGONGDAN 7-RO, SEOBUK-GU, CHEONAN-SI |
| CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 136-729 |
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| NOVAK DRUCE CONNOLLY BOVE + QUIGG LLP |
| 1875 EYE ST NW |
| SUITE 1100 |
| WASHINGTON, DC 20006-5409 |
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