Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/13/2018
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Application #:
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14908778
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Filing Dt:
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01/29/2016
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Publication #:
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Pub Dt:
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06/16/2016
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Inventors:
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Xianxian YU, Yanyan LI, Su WANG, Li MA
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Title:
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ADDITIVE C CAPABLE OF CHANGING MICROVIA-FILLING METHOD BY TSV COPPER PLATING, AND ELECTROPLATING SOLUTION CONTAINING SAME
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 3600, SIXIAN ROAD, SONGJIANG DISTRICT |
SHANGHAI, CHINA 201616 |
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OSTROLENK FABER LLP |
1180 AVENUE OF THE AMERICAS |
NEW YORK, NY 10036-8403 |
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