Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/20/2018
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Application #:
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15268169
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Filing Dt:
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09/16/2016
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Publication #:
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Pub Dt:
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03/22/2018
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Inventors:
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Chi-Kuei Lee, Ying Chung, Ying-Chih Kuo, Wei-Feng Lin
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Title:
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Microchip with Cap Layer for Redistribution Circuitry and Method of Manufacturing the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4275 BURTON DRIVE |
| SANTA CLARA, CALIFORNIA 95054 |
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| LARRY E. HENNEMAN, JR. |
| 70 N. MAIN ST. |
| THREE RIVERS, MI 49093 |
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