Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/27/2018
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Application #:
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15222968
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Filing Dt:
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07/29/2016
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Publication #:
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Pub Dt:
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02/01/2018
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Inventors:
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Bo-Qiao Lin, Ting-Chou Lin, Chun-Yi Yang, Yao-Wen Chang
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Title:
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Redistribution Layer Routing for Integrated Fan-Out Wafer-Level Chip-Scale Packages
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 213R., INNOVATION INCUBATOR, NO. 101, SEC. 2, KUANG-FU RD., |
| HSINCHU, TAIWAN 300 |
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| ANGELA HUANG |
| OFFICE 210, 1250 OAKMEAD PARKWAY, |
| SUNNYVALE, CA 94085 |
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