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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9932684
Issue Dt:
04/03/2018
Application #:
15220472
Filing Dt:
07/27/2016
Publication #:
20170037527
Pub Dt:
02/09/2017
Inventors:
Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek et al
Title:
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF ALPHA AMINO ACIDS AND BISEPOXIDES
Assignment: 1
Reel/Frame:
045254/0822Recorded: 03/16/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
THORSETH, MATTHEW A.
Exec Dt:
09/15/2015
NIAZIMBETOVA, ZUHRA
Exec Dt:
09/14/2015
QIN, YI
Exec Dt:
09/15/2015
DZIEWISZEK, JOANNA
Exec Dt:
09/21/2015
REDDINGTON, ERIK
Exec Dt:
09/28/2015
LEFEBVRE, MARK
Exec Dt:
09/15/2015
Assignee:
ROHM AND HAAS ELECTRONIC MATERIALS LLC
455 FOREST STREET
MARLBOROUGH, MASSACHUSETTS 01752
Correspondent:
DANNY CHILDS
2040 DOW CENTER
MIDLAND, MI 48674
Assignment: 2
Reel/Frame:
045254/0928Recorded: 03/16/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
WOERTINK, JULIA
Exec Dt:
09/15/2015
Assignee:
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER
MIDLAND, MICHIGAN 48674
Correspondent:
DANNY CHILDS
2040 DOW CENTER
MIDLAND, MI 48674

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