Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/03/2018
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Application #:
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15232175
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Filing Dt:
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08/09/2016
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Publication #:
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Pub Dt:
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02/23/2017
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Inventors:
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Hiroyuki Yasuda, Michihiro Sugo, Shohei Tagami, Masahito Tanabe
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Title:
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WAFER PROCESSING BONDING ARRANGEMENT, WAFER LAMINATE, AND THIN WAFER MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| WESTERMAN, HATTORI, DANIELS & ADRIAN LLP |
| 1250 CONNECTICUT AVENUE NW, |
| SUITE 700 |
| WASHINGTON, DC 20036 |
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