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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/03/2018
Application #:
15291063
Filing Dt:
10/11/2016
Publication #:
Pub Dt:
05/04/2017
Inventors:
Byeong Ho JEONG, Eun Dong KIM, Jong Won LEE, Hyun Hak JUNG, Jai Kyoung CHOI
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
040050/0183Recorded: 10/19/2016Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/07/2016
Exec Dt:
10/07/2016
Exec Dt:
10/07/2016
Exec Dt:
10/07/2016
Exec Dt:
10/07/2016
Assignee:
16, BAEKSEOKGONGDAN 7-RO, SEOBUK-GU
CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31094
Correspondent:
RENAISSANCE IP LAW GROUP LLP (PIP)
9600 SW OAK ST. SUITE 560
PORTLAND, OR 97223

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